In order to simplify the fabrication process of a vibrating ring gyroscope and to improve its finished products,a fabricating method combing Deep Reactive Ion Etching(DRIE) and anodic bonding technologies was proposed to fabricate sensor structures. The operating principles of the vibrating ring gyroscope and the technological drawbacks in the traditional fabrication process were discussed. Then, the processing flows based on DRIE and anodic bonding technologies were carefully designed,and the effect of different technological parameter on the gyroscope performance was analyzed. On the basis of the analyzed results,the technological flows and parameters were modified. Finally, a single-crystal silicon vibrating ring gyroscope with a high aspect ratio was fabricated and tested. Experimental results indicate that the proposed method can fabricate a vibrating ring gyroscope with 3 μm capacitance gaps and 80 μm depth.In comparison with traditional fabrication technologies, the number of masks has been reduced from 7 to 2,which meets the device requirements for simplicity and stabilization.