Infrared detection and imaging are crucial in a plethora of applications, such as missile guidance, night vision reconnaissance, security monitoring, and hazardous chemical detection. Current infrared imaging focal planes primarily utilize bulk semiconductor materials such as mercury cadmium telluride, type-II superlattice, and indium antimonide. These materials require flip bonding to electrically couple with silicon-based readout circuits. However, the complexity of this coupling process increases sharply as the array size increases and the pixel size decreases. This study proposes an innovative solution to overcome the flip bonding limitation by using mercury telluride colloidal quantum-dots. By employing a liquid phase spin coating method, we can achieve direct on-chip integration of silicon-based readout circuits. The scale of the resulting focal-plane array reached an impressive 1280×1024, with a pixel spacing of 15 μm. Operating at a temperature of 80 K, the detection cut-off wavelength was found to be 4.8 μm. The response nonuniformity stood at 9%, while the effective pixel rate was measured at 99.96%. Furthermore, the lowest noise equivalent temperature difference reached 30 mK, demonstrating a good imaging performance.