Acta Optica Sinica, Volume. 37, Issue 10, 1023002(2017)
Optical and Thermal Performance of LED Light Source Packaged by Al/Al2O3 Composite Substrate
To obtain light emitting diode (LED)-packaged substrate with high luminous efficiency and high thermal conductivity, the direct aluminum (Al) plating technology is used to prepare aluminum/aluminum oxide (Al2O3) composite ceramic substrate whose surface is also polished by chemical-mechanical method. The optical and thermal performance of the LED light source packaged by this composite substrate are simulated by using the optical simulation software Tracepro and the thermal simulation software ANSYS. This LED light source is also compared with the traditional alumina ceramic substrate package LED light source. Finally, the prepared aluminum/alumina ceramic substrate is packaged into an on-board chip-mounted (COB) type LED light source for testing. Both results of simulation and experimental tests show that the aluminum/alumina ceramic substrate prepared by direct aluminum process has faster heat transfer rate, better thermal conductivity and it is more suitable for high power LED light source packaging. LED packaged by Al/Al2O3 ceramic substrate has bigger luminous flux and higher luminous efficiency, compared with the light source packaged by traditional Al2O3 ceramic substrate.
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Haitao Zhu, Renli Fu, Meng Fei, Caixia Wang, Lei Ji. Optical and Thermal Performance of LED Light Source Packaged by Al/Al2O3 Composite Substrate[J]. Acta Optica Sinica, 2017, 37(10): 1023002
Category: Optical Devices
Received: May. 2, 2017
Accepted: --
Published Online: Sep. 7, 2018
The Author Email: Fu Renli (renlifu@nuaa.edu.cn)