Optics and Precision Engineering, Volume. 31, Issue 5, 746(2023)
CDEM-DEM analysis of the coupled wheel-ground dynamics behavior
The dynamic mechanical wheel-ground interaction is extremely complex when off-road vehicles are driven on soft soil pavements, and the extent of wheel sagging and traversability are of significant interest in the field of vehicle ground mechanics. This study proposes a calculation approach that uses the continuum-discontinuum element method (CDEM) and discrete element method (DEM) in combination to analyze the dynamic performance of wheels on soft-soil pavements. In the proposed method, the wheel is modeled using CDEM elements, the soft-soil pavement is modeled using DEM particles, and a penalty spring is used to connect both models. The application of dynamic torque to the wheel allows for the accurate simulation of the friction, rolling, and forward motion of the wheel on the soft-soil pavement. By combining CDEM and DEM, the study explores the effect of wheel patterns and roadblocks on the dynamic behavior of the vehicle during driving. The results show that both patterned and glossy wheels leave visible ruts on the soft-soil road surface, with patterned tires having better traversability than glossy ones. The rotation speed of patterned wheels is slower, but their translation speed is much faster than that of glossy wheels, with a translation-to-linear speed ratio of 12.78% for patterned wheels and 2.80% for glossy wheels. During driving on soft-soil roads, glossy wheels sink deeper into the ground compared to patterned wheels with the same weight. Furthermore, when driving over roadblocks, the degree of ground undulation has a direct impact on vehicle energy consumption, with greater undulation requiring more energy.
Get Citation
Copy Citation Text
Yang LU, Chun FENG, Pengda CHENG, Yiming ZHANG. CDEM-DEM analysis of the coupled wheel-ground dynamics behavior[J]. Optics and Precision Engineering, 2023, 31(5): 746
Category: Path planning
Received: Sep. 22, 2022
Accepted: --
Published Online: Apr. 4, 2023
The Author Email: FENG Chun (fengchun@imech.ac.cn)