Optics and Precision Engineering, Volume. 16, Issue 3, 452(2008)

Thickness uniformity of Ni microstructure deposited by through-mask electroplating

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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Thickness uniformity of Ni microstructure deposited by through-mask electroplating[J]. Optics and Precision Engineering, 2008, 16(3): 452

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    Received: Oct. 9, 2007

    Accepted: --

    Published Online: Jul. 8, 2008

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