Chinese Journal of Lasers, Volume. 44, Issue 1, 102016(2017)
Dicing of Sapphire Wafer with All-Fiber Picosecond Laser
An all-fiber ultrafast laser system was demonstrated by utilizing polarization-maintaining fibers and polarization-maintaining fiber components. The central wavelength of the system was 1064 nm. A passively mode-locked fiber laser, a pulse selector, and subsequent fiber amplifiers realized micro joule pulse energy with tunable repetition rate and alterable pulse number in a single pulse string. In addition, an application of this laser system was carried out on dicing of 110 μm thick sapphire wafer. Experimental results showed that the pulse energy, the pulse number in a single pulse string, and the beam quality significantly affected the ablation performance. Up to 99.58% yield rate was achieved by using 100 kHz repetition rate, 7 pulses in a pulse string, 97% beam circularity, 0.37 W average power, and 600 mm/s dicing speed.
Get Citation
Copy Citation Text
Hu Xiaobao, Hao Qiang, Guo Zhengru, Zeng Heping. Dicing of Sapphire Wafer with All-Fiber Picosecond Laser[J]. Chinese Journal of Lasers, 2017, 44(1): 102016
Special Issue:
Received: Jun. 24, 2016
Accepted: --
Published Online: Jan. 10, 2017
The Author Email: Xiaobao Hu (xiaobao_hu@foxmail.com)