Acta Optica Sinica, Volume. 41, Issue 20, 2031003(2021)

Development of Infrared Antireflection Coating for Molded Chalcogenide Glass Elements

Xiuhua Fu1, Haifeng Wang1、*, Jing Zhang1, Gong Zhang1, Zhongju Ren1, Xiaoping Zhou2, and Fei Yang3
Author Affiliations
  • 1School of Opto-Electronic Engineering, Changchun University of Science and Technology, Changchun, Jilin 130022, China
  • 2School of Mechatronic Engineering, Changchun University of Science and Technology, Changchun, Jilin 130022, China
  • 3Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, Jilin 130033, China
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    For the purpose of achieving high-quality athermal imaging in the infrared detection system, an antireflection coating in the wave band of 3.7-4.8 μm was prepared on aspheric chalcogenide glass substrate. Adhesive layer material was selected in the experiment to improve the adhesion between the substrate and the coating. The finite element method and multi-physics simulation software were used to build a three-dimensional model that combined temperature field and thermal stress field. The stress distribution of aspheric film was analyzed. In view of the simulation results, the deposition process was optimized. The thermal stress of the chalcogenide glass substrate was reduced by temperature gradient heating and the stress of the deposited film was released by in-situ vacuum annealing so as to solve the film stripping problem of the aspheric mirror. The prepared film passed the tests of adhesion, humidity, and moderate friction of the MIL-C-48497A standard and the average transmittance in the wave band of 3.7-4.8 μm was 99.12%, which means the prepared film met the index requirements of infrared detection system.

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    Xiuhua Fu, Haifeng Wang, Jing Zhang, Gong Zhang, Zhongju Ren, Xiaoping Zhou, Fei Yang. Development of Infrared Antireflection Coating for Molded Chalcogenide Glass Elements[J]. Acta Optica Sinica, 2021, 41(20): 2031003

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    Paper Information

    Category: Thin Films

    Received: Mar. 30, 2021

    Accepted: May. 6, 2021

    Published Online: Sep. 30, 2021

    The Author Email: Wang Haifeng (WHF1102218322@163.com)

    DOI:10.3788/AOS202141.2031003

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