Laser & Optoelectronics Progress, Volume. 59, Issue 9, 0922026(2022)

Systems Engineering Methods and Their Applications in Field of Advanced Semiconductor Equipment

Feng Shu1, Zhilei Xu2, Le He3, and Xiaofeng Yang4、*
Author Affiliations
  • 1Academy for Engineering and Technology, Fudan University, Shanghai 200433, China
  • 2Qingyuan Research Institute, Shanghai Jiao Tong University, Shanghai 200240, China
  • 3Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai 201203, China
  • 4State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai , 200433, China
  • show less

    Systems engineering methods have played an important role in the research and development of complex equipment and systems represented by aerospace, defense technology, and ship engineering at home and abroad. For the research and development of advanced semiconductor equipment such as lithography machines, it is particularly important to develop independent innovation and integrated design and manufacturing capabilities led by forward design and guided by systems engineering methods. Starting from the origin of systems engineering, this paper gives a survey of the common methods of systems engineering, and focuses on the related systems engineering tool chains and key technologies of model-based systems engineering with the applications in the field of semiconductor equipment as the background. Finally, this paper looks forward to the application prospects of systems engineering methods, especially model-based systems engineering methods, in domestic semiconductor equipment industry.

    Tools

    Get Citation

    Copy Citation Text

    Feng Shu, Zhilei Xu, Le He, Xiaofeng Yang. Systems Engineering Methods and Their Applications in Field of Advanced Semiconductor Equipment[J]. Laser & Optoelectronics Progress, 2022, 59(9): 0922026

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Optical Design and Fabrication

    Received: Jan. 25, 2022

    Accepted: Mar. 14, 2022

    Published Online: May. 10, 2022

    The Author Email: Yang Xiaofeng (xf_yang@fudan.edu.cn)

    DOI:10.3788/LOP202259.0922026

    Topics