Laser & Optoelectronics Progress, Volume. 60, Issue 11, 1106014(2023)

Research Progress of Novel Metasurface Spectral Imaging Chips

Tingting Wang1,2、*, Hongxing Cai1,2、**, Shuang Li1,2, Yu Ren1,2, Jing Shi1,2, Jianwei Zhou1,2, Dongliang Li1,2, Shuangshuang Ding1,2, Yangyang Hua1,2, and Guannan Qu1,2
Author Affiliations
  • 1School of physics, Changchun University of Science and Technology, Changchun 130022, Jilin, China
  • 2Key laboratory of Jilin Province for Spectral Detection Science and Technology, Changchun University of Science and Technology, Changchun 130022, Jilin, China
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    Spectral imaging has been widely used in food safety, medical diagnosis, environmental monitoring, camouflage identification, and military remote sensing because of its excellent multidimensional information acquisition capability. Traditional spectral imaging systems are limited by spectroscopic components, suffering from problems such as large sizes, high costs, and low integration. Novel metasurface-based spectral imaging chips can provide an effective solution for obtaining miniaturized and low-cost sensors. With the continuous increase in demand for spectral analysis, the development of metasurface spectral imaging chips has accelerated. We review the recent research progress of metasurface spectral imaging chips. On this basis, we present the latest research results of our team. Through the innovative design of the imaging spectral chip system architecture, a high energy utilization rate, spatial resolution, and spectral resolution can be achieved simultaneously, providing a solid foundation for the application of chip-level spectral imaging systems. Finally, we discuss the development trend and application prospects of spectral imaging chips, providing a reference for the miniaturization of the spectral imaging system.

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    Tingting Wang, Hongxing Cai, Shuang Li, Yu Ren, Jing Shi, Jianwei Zhou, Dongliang Li, Shuangshuang Ding, Yangyang Hua, Guannan Qu. Research Progress of Novel Metasurface Spectral Imaging Chips[J]. Laser & Optoelectronics Progress, 2023, 60(11): 1106014

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    Paper Information

    Category: Fiber Optics and Optical Communications

    Received: Apr. 8, 2023

    Accepted: May. 11, 2023

    Published Online: Jun. 14, 2023

    The Author Email: Wang Tingting (ttwang@cust.edu.cn), Cai Hongxing (caihx@cust.edu.cn)

    DOI:10.3788/LOP231244

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