Acta Optica Sinica, Volume. 34, Issue s1, 114012(2014)
Technologic Investigation of Laser Micro-Drilling on the Thin Ceramic Plate
The laser precision micromachining processes on the thin ceramic plate are investigated. By taking pulse laser drilling as well as laser cutting technology, this work aims at improving the heat affected zone of laser processing as well as the conicity of microhole and increasing laser processing efficiency to satisfy the industrial requirement. The laser process parameters including laser output power, duty cycle, repeated frequency, the offset of focus spot, the type of assistant gas and gas pressure are optimized in the experiments. The results show that the microholes with diameter of 80~200 μm are obtained by using CO2 laser drilling on ceramic plate and its efficiency up to 18 hole/s; the heat affected zone has also been significantly improved. The conicity controllable microholes are achieved by single pulse drilling technology with fiber laser and its efficiency achieves 300 hole/s. The stable laser precision micromachining on the ceramics for the straight microholes with diameter of 100 μm is also obtained by laser cutting technology using fiber laser and its efficiency achieves 6~8 hole/s.
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Xiao Lei, Zhao Jiantao, Yan Zhenfeng, Yao Yong. Technologic Investigation of Laser Micro-Drilling on the Thin Ceramic Plate[J]. Acta Optica Sinica, 2014, 34(s1): 114012
Category: Lasers and Laser Optics
Received: Mar. 3, 2014
Accepted: --
Published Online: Jul. 22, 2014
The Author Email: Lei Xiao (lei.xiao@hanslaser.com)