Acta Optica Sinica, Volume. 34, Issue s1, 114012(2014)

Technologic Investigation of Laser Micro-Drilling on the Thin Ceramic Plate

Xiao Lei1,2、*, Zhao Jiantao2, Yan Zhenfeng2, and Yao Yong1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less

    The laser precision micromachining processes on the thin ceramic plate are investigated. By taking pulse laser drilling as well as laser cutting technology, this work aims at improving the heat affected zone of laser processing as well as the conicity of microhole and increasing laser processing efficiency to satisfy the industrial requirement. The laser process parameters including laser output power, duty cycle, repeated frequency, the offset of focus spot, the type of assistant gas and gas pressure are optimized in the experiments. The results show that the microholes with diameter of 80~200 μm are obtained by using CO2 laser drilling on ceramic plate and its efficiency up to 18 hole/s; the heat affected zone has also been significantly improved. The conicity controllable microholes are achieved by single pulse drilling technology with fiber laser and its efficiency achieves 300 hole/s. The stable laser precision micromachining on the ceramics for the straight microholes with diameter of 100 μm is also obtained by laser cutting technology using fiber laser and its efficiency achieves 6~8 hole/s.

    Tools

    Get Citation

    Copy Citation Text

    Xiao Lei, Zhao Jiantao, Yan Zhenfeng, Yao Yong. Technologic Investigation of Laser Micro-Drilling on the Thin Ceramic Plate[J]. Acta Optica Sinica, 2014, 34(s1): 114012

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Lasers and Laser Optics

    Received: Mar. 3, 2014

    Accepted: --

    Published Online: Jul. 22, 2014

    The Author Email: Lei Xiao (lei.xiao@hanslaser.com)

    DOI:10.3788/aos201434.s114012

    Topics