International Journal of Extreme Manufacturing, Volume. 4, Issue 4, 45103(2022)
Fabrication of extreme wettability surface for controllable droplet manipulation over a wide temperature range
Droplet controllable manipulation over a wide temperature range has promising applications in microelectronic heat dissipation, inkjet printing, and high temperature microfluidic system. However, the fabrication of a platform for controllable droplet manipulation using the methods commonly used in industry remains a tremendously challenge. The popular method of controlling droplets is highly dependent on external energy input and has relatively poor controllability in terms of droplet motion behaviors and manipulation environment, such as distance, velocity, direction and a wide temperature range. Here, we report a facile and industrially applicable method for preparing Al superhydrophobic (S-phobic) surfaces, which enables controlled droplet bouncing, evaporation, and transport over a wide temperature range. Systematic mechanistic studies are also investigated. Extreme wettability surfaces were prepared on Al substrate by a composite process of electrochemical mask etching and micro-milling. To investigate the evaporation process and thermal coupling characteristics, controlled evaporation and controlled bouncing of droplet in a wide temperature range were conducted. Based on the evaporation regulation and bouncing mechanism of droplets on an extreme wettability surface, by using Laplace pressure gradients and temperature gradients, we realized controlled transport of droplets with confluence, split-flow, and gravity-resistant transport over a wide temperature range, offering a potential platform for a series of applications, such as new drug candidates and water collection.
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Chengsong Shu, Qitong Su, Minghao Li, Zhenbin Wang, Shaohui Yin, Shuai Huang. Fabrication of extreme wettability surface for controllable droplet manipulation over a wide temperature range[J]. International Journal of Extreme Manufacturing, 2022, 4(4): 45103
Received: Feb. 3, 2022
Accepted: --
Published Online: Mar. 4, 2023
The Author Email: Huang Shuai (huangshuai9228@126.com)